FEA / Board Stress Analysis (BSA)
Understanding where the stress on your UUT is important to be able to respond with counterforce to ensure the board is held within acceptable tolerances. We utlize computer modeling to aid in this process.
BSA has been a useful tool for designers and fixture manufacturers for more than a decade. This tool has allowed designers to minimize induced stresses on the printed circuit board (PCB) under test, and all but eliminate the potential for damage. Board Stress Analysis (BSA) allows for a simulation to be performed before the unit-under-test (UUT) is subjected to potentially damaging forces. Further, once the simulation is run, push fingers, board supports and even probes can be repositioned to reduce flexing and lower stresses placed on the UUT. Typically, the BSA is rerun in an iterative process that successively betters the fixture design until the desired result is achieved.
FEA – Physical Measurement of PCB stress under an actuated state in the test fixture.
BSA – A simulation of the forces being placed upon the PCB from the test fixture, this allows changes to be made to reduce or accommodate the forces that are expected in the fixture once it is assembled.