Board Stress Analysis (BSA)
BSA has been a useful tool for designers and fixture manufacturers for more than a decade. This tool has allowed designers to minimize induced stresses on the printed circuit board (PCB) under test, and all but eliminate the potential for damage. Board Stress Analysis (BSA) allows for a simulation to be performed before the unit-under-test (UUT) is subjected to potentially damaging forces. Further, once the simulation is run, push fingers, board supports and even probes can be repositioned to reduce flexing and lower stresses placed on the UUT. Typically, the BSA is rerun in an iterative process that successively betters the fixture design until the desired result is achieved.